Jun 21, 2021 12:06 PM (GMT+8) · EqualOcean
Kuaike said on the interactive platform that the company's nano silver sintering equipment for the packaging of third-generation semiconductor high-power devices and vacuum eutectic welding equipment for the packaging of high reliable and high-power chips are currently under development; The company's laser marking equipment in the semiconductor packaging field has begun to have a small number of orders.