The funding was provided by CICC, CMB International Capital, and Puhua Capital. HYMN will use this funding for mergers and acquisitions as well as R&D.
HYMN's focus areas, according to Hao Chen, the CEO of HYMN, are chip process, R&D in packing material and high thermal conductivity metal, and management solutions, with plans to expand into other niche markets. Their target M&A company is an advanced metal material solution provider with a strong presence in "New Infrastructure Construction," with a focus on new energy vehicles, batteries, and service computing.
HYMN believes that the M&A model, which other large foreign companies have used to fill this shortage in certain technology, will help them grow faster, in the same way that the chip industry grew quickly but R&D took a long time. Through M&A, HYMN has broadened its focus to include a thermal interface, metal, chip, and electromagnetic shielding.
With trade tensions on the rise, HYMN maintains its strategy of entering the international market while keeping a close eye on the prospect of M&A targets and broadening its product and service line to achieve its position in the Heat Dissipation Material. China is a latecomer to material science, and it is already lagging behind other countries. Hao Chen believes they should focus on their strengths.
Investors value HYMN because it possesses characteristics that are uncommon in a start-up company, such as robust growth potential, strong market power, sales channels, management ability, and high-caliber talent.