Recently, SiEngine Technology announced that it has successfully completed its A+ round of financing with a total amount of nearly CNY 500 million in the fourth quarter of 2022.
Recently, SiEngine Technology Co., Ltd, (Chinese: 芯擎科技) a provider of high-performance automotive-grade integrated processor solutions, announced that it has successfully completed its A+ round of financing with a total amount of nearly CNY 500 million (USD 72 million) in the fourth quarter of 2022.
Investment institutions participating in this round of financing include TEDA (Chinese: 泰达科投), Haier Capital (Chinese: 海尔资本), SPDB International (Chinese: 浦银国际), Wuhan Innovation Investment (Chinese: 武汉创新投), Tongxi Capital (Chinese: 桐曦资本), etc. The funds raised in this round will be used for the mass production supply of SiEngine Technology's existing mature products, as well as R&D, flow-through and mass production market launch related to product iterations.
It is worth noting that this is the third round of financing completed by SiEngine Technology in 2022. Previously, in March 2022, SiEngine Technology received a strategic investment from FAW Group (Chinese: 一汽集团). In July of the same year, SiEngine Technology completed a round of financing of nearly CNY 1 billion, led by Sequoia China (Chinese: 红杉中国), followed by Neusoft Capital (Chinese: 东软资本) and Boyuanl(Chinese: 博原资本).
SiEngine Technology offers comprehensive solutions for high-end automotive system-on-chips (SoCs), which integrate all or most components of a vehicle's electronic system. Its offerings range from automotive chips to compatible software and hardware with three major product lines covering smart cockpit multimedia Sos, autonomous driving chips and in-vehicle central computing chips.