EqualOcean has learned that Adaps Photonics（灵明光子）, a 3D sensor chip and solution provider, has successfully completed a new round of financing, introducing SAIC Ventures（上汽创投） as a new shareholder, with Lighthouse Capital（光源资本） as the exclusive financial advisor.
Founded in May 2018, Adaps Photonics is headquartered in Shenzhen's Nanshan district and has a research and development center in Shanghai's Zhangjiang town, with over 80% of its staff dedicated to R&D. The company has been recognized as a high-level overseas talent team in Shenzhen and has received numerous accolades, including being designated a national-level specialized and innovative "Little Giant" enterprise（小巨人企业）, a specialized and innovative small and medium-sized enterprise in Shenzhen, and a national high-tech enterprise.
Adaps Photonics' single-photon avalanche diode (SPAD) design is a core component enabling 3D perception in modern electronic devices, widely applied in sectors such as automotive, smartphones, robotics, automation, human-machine interaction, and smart homes. The company offers a range of SPAD dToF sensor chip products, including SiPM, 3D stacked dToF modules, and limited-point dToF sensors, boasting industry-leading precision, energy efficiency, and range in distance measurement.
3D sensors are crucial components of intelligent in-car cameras, differentiating themselves from traditional cameras by enabling advanced functionalities. As the wave of automotive intelligence rises, the Chinese in-car camera industry is expected to continue its rapid growth, with a projected market size of CNY 256.79 billion by 2026, offering significant market potential.
In the field of in-car sensor chip manufacturing, notable domestic players include visionICs（芯视界微电子）, FORTSENSE（阜时科技）, MicroParity（宇称电子）, PolarisIC（北极芯微）, and Liangxin Integrated Technology（量芯集成科技）. Currently, the industry landscape is dominated by overseas leaders in receiver detector technology, but domestic manufacturers are poised to achieve localization of SPAD and SiPM technologies. Japanese companies such as Hamamatsu, Sony, and Onsemi hold significant advantages in product maturity and reliability.
The funds raised in this round will be allocated to further research and development of 3D sensor chips and expansion of production capacity. The successful financing round reflects the recognition of Adaps Photonics' leading technological capabilities in the field of automotive-grade products by both new and existing shareholders.