Amidst the ongoing 2024 graduate recruitment season, as one of the most popular enterprises for domestic graduates, Huawei HiSilicon released a range of posts on the official website. Among them, many sales positions place "accepting global business trips" on the top of the job requirements, suggesting the company's intention to explore overseas markets in the future.
In August 2023, Huawei Mate 60 was officially launched. Equipped with Kirin flagship chips again after three years, the release of the Mate 60 series sparked heated discussions and once again shifted public attention to the chip manufacturing company, Huawei HiSilicon. Recently, Huawei HiSilicon opened many positions for 2024 graduates, many of which require oversea expatriation, giving rise to speculations that the company may vigorously expand its overseas market in the future.
When it comes to Huawei HiSilicon, some might have heard of two subordinate companies called "Big HiSilicon" and "Little HiSilicon". The predecessor of the so-called "Big HiSilicon" was Huawei Integrated Circuit Design Center founded in 1991, which later registered as Shenzhen HiSilicon Semiconductor Co., Ltd. in the year 2004. Its produces a range of chips such as Kirin, Kunpeng, and Balong, serving the development of ICT business. The company commonly known as "Little HiSilicon" is Shanghai HiSilicon Technology Co., Ltd. established in 2018, which mainly develops chips for external supply services. Huawei's latest Mate 60 series mobile phone chips were in fact manufactured by Shenzhen HiSilicon.
Having endured over three years of technology blockade and export controls, the Mate 60 phone adopted the Kirin chip again, demonstrating robust performance and innovative advantages. Thanks to its popularity, HiSilicon's market share has significantly increased. According to data released by a market research institution, it ranked fifth in the global smartphone application processor market in the third quarter of 2023, with the top four being Qualcomm, Apple, MediaTek, and Samsung. Aside from re-adopting Kirin chips, Huawei HiSilicon's major businesses are also gradually recovering. As of now, HiSilicon has set up 12 offices and R&D centers in China, Singapore, South Korea, Japan, Europe, and other places. Its products and services are distributed in more than 100 countries and regions around the world.
Amidst the ongoing recruitment of 2024 graduates, a crucial time period for graduates to seek job opportunities and for enterprises to employ talents, Huawei HiSilicon, as one of the most popular companies for domestic graduates, has posted on its official website a wide spectrum of job positions, including R&D, sales, supply chain, human resources, law works and other categories. Job posts in the R&D branch, like before, still prioritize employees' skills. However, this year, sales jobs demonstrate a major highlight, for many of them clearly indicate the need for job seekers to "accept global business trips". For example, for the "Customer Manager" position, at at the end of the description lies this sentence: "If you are ambitious, willing to take on challenges, striving for success, and expecting to gain international work experience, then you are the person we are looking for!" It follows then that 2024 graduates intending to work overseas and displaying relevant competence have become prospective employees that Huawei Hisilicon is seeking.
Sales, as an important job category for close contact with potential customers, external promotion, and expanding the enterprise market, is more susceptible to the changs of the corporate layout, positioning, as well as the intended customer group. Integrating such positions into the global framework, Huawei HiSilicon sent possible signals of overseas business expansion, giving rise to expectations from the public of its new developments.