CES 2026 opened on January 6 in Las Vegas, with Chinese AI chip company Black Sesame Technologies (黑芝麻智能) making its fifth appearance at the global technology event. The company showcased its latest developments across three areas—advanced driver assistance, embodied intelligence and consumer electronics—highlighting its capabilities in powering intelligent industries with AI-driven computing.
The latest CES appearance marked another global presentation of Black Sesame Technologies’ technological progress and underscored its strategic shift from supporting driver assistance toward driving full-spectrum intelligent evolution.
At the show, Black Sesame Technologies unveiled, for the first time, a deep-function demonstration platform for its Huashan A2000 (华山 A2000) full-scenario general-purpose advanced driver assistance solution. The company has built a comprehensive product portfolio for the intelligent vehicle sector, with the Huashan series focused on driver assistance and the Wudang series dedicated to cross-domain computing. Both product lines were key highlights at CES 2026.
The Huashan A2000 adopts a large-core architecture combined with algorithm–hardware co-design and system-level optimisation. Powered by Black Sesame Technologies’ latest Jiushuo NPU (九韶 NPU), the chip’s measured performance is comparable to leading global intelligent driving chips. The Huashan A2000 is expected to support applications such as VLM- and VLA-based intelligent driver assistance as well as in-cabin AI Box solutions. Ahead of CES 2026, the Huashan A2000 passed relevant U.S. regulatory reviews and was officially introduced to global markets. Black Sesame Technologies has already worked closely with major Chinese automakers including Dongfeng Motor Corporation (东风汽车), Geely (吉利汽车), Hongqi (红旗汽车) and JAC Motors (江淮汽车), bringing advanced driver assistance technologies into mass-produced vehicles.
The exhibition also marked the overseas debut of the Wudang C1296 (武当 C1296) cockpit–driving integrated mass-production solution. The solution was jointly developed by Dongfeng Motor Corporation and Joyson Electronics (均联智行), using a single C1296 chip to enable digital instrument clusters, intelligent cockpits and advanced driver assistance functions. Integrated cockpit–driving edge AI solutions from Banma Network Technology (斑马智行) based on the C1296 were also displayed at the show. The Wudang series is positioned as a core driver of cross-domain integration in automotive electronic and electrical architectures, with multiple industry players developing high-integration mass-production solutions based on Wudang chips.
In the embodied intelligence segment, Black Sesame Technologies presented the first overseas showcase of its SesameX multi-dimensional embodied intelligence computing platform. Introduced in 2025 as the industry’s first computing platform designed for the commercial deployment of robots, SesameX is positioned as an open, scalable and mass-producible computing foundation for robotics. The platform comprises the Kalos, Aura and Liora series, addressing robots of varying complexity and form factors, and aims to enable large-scale industrial deployment through a “robot whole-brain” architecture.
At CES 2026, a range of physical robots and application solutions based on the SesameX platform were displayed, including the world’s first dual-wheel-legged outdoor companion robot Rovar X3, Fourier dexterous hands (傅利叶灵巧手), and a waste-sorting robotic arm powered by the SesameX Kalos computing platform.
Beyond intelligent vehicles and embodied intelligence, Black Sesame Technologies also showcased its AI imaging solutions for consumer electronics, where cumulative global deployments have exceeded 500 million devices. The company recently completed a strategic controlling acquisition of Eeasy Technology (亿智电子), integrating its strengths in low-power, cost-effective AI SoC chips. Products related to Yizhi Electronics were also presented at CES 2026.
Black Sesame Technologies’ AI imaging solutions are now applied across smartphones, tablets, cameras and AI glasses, delivering enhanced user experiences through deep integration of chips and algorithms. Notably, Li Auto’s (理想汽车) first AI glasses product, Livis, incorporates Black Sesame Technologies’ AI imaging solutions, including HDR fusion, multi-frame noise reduction, video stabilisation, night enhancement and portrait optimisation. A range of consumer products adopting these solutions—including 4K dual-channel dash cameras, smartphone gimbal stabilisers, learning devices and home security systems—were also unveiled at the show.
As intelligent technologies continue to advance, Black Sesame Technologies is expanding beyond intelligent vehicles into embodied intelligence and consumer electronics, aiming to provide a powerful computing “core engine” for the industry and inject momentum into the next stage of intelligent transformation.