KiwiMoore, a provider of chiplet products and services, harvests an angle financing round worth CNY 100 million (USD 14.78 million), led by CASSTAR.
KiwiMoore(Chinese:奇异摩尔), a high-tech company providing chiplet products and services, announced its closing of an angle financing round worth CNY 100 million (USD 14.78 million), led by CASSTAR. Fosun Capital, Junsan Capital, Chaoke Investment, Shenzhen Huaqiu and Step Investment followed the investment. This round of funding will be mainly used for R&D related to high-performance CMOS universal base (Base die), recruitment, marketing and other aspects, news portal 36kr.com reported.
KiwiMoore is a chiplet product and service provider established in early 2021. As one of the first companies in China to focus on 2.5D and 3DIC Chiplet products and services, it provides 2.5D and 3DIC Chiplet heterogeneous integrated universal products and full-link services including high-performance universal base die, high-speed interface core IO Die, Chiplet software design platform and other products. Its products support functions of high-speed communication interface, distributed near storage, efficient power network and other functions required by high computing chip customers, mainly used in the next-generation data center, autonomous driving, meta-universe and other fast-growing markets.
The 2.5D and 3DIC Chiplet solutions, which can shift the reliance of high-performance chips on advanced process advancement to the latitude of advanced packaging technology and can significantly reduce the design development and production cost of high-performance chips, are of special significance to China's IC industry under the current severe situation of the global semiconductor industry facing fragmentation, according to Xiaobao Lu, Managing Director of CASSTAR.
KiwiMoore's international competitors include AMD and ARM and domestic ones include Innosilicon (Chinese:芯动科技), M2 Semi (Chinese:超摩科技) and Chipuller(Chinese:奇普乐).