Ainstec, a company focusing on "AI+3D" autonomous core chip technology, announced its Series A+ financing round worth tens of millions of CNY, led by Meridian Capital.
Ainstec(Chinese:中科融合), a company focusing on "AI+3D" autonomous core chip technology, announced its Series A+ financing round worth tens of millions of CNY, led by Meridian Capital, with participation by Maxonic, Silicon Harbour and Hainan Inhope Investment Co., Ltd.
Ainstec has entered the 3D imaging market with Micro-Electro-Mechanical System (MEMS) structured light 3D sensing module, providing 3D vision sensor solutions that can be used in robotics, medical and other fields.
The money will be mainly used for chip development and mass production of 3D sensing module products.
Wang Xuguang, the CEO of Ainstec, said that Ainstec provides intelligent 3D vision solutions to head customers in industrial, medical, and automotive fields. The company's intelligent 3D vision core modules and 3D vision camera Turnkey solutions have an overwhelming price advantage.
Current 3D technology in high-precision professional fields has the pain points of being expensive and complex. Most vision chips use products from foreign companies, such as Texas Instruments' DLP and NVIDIA's GPU, which are expensive and costly.
Ainstec has MEMS needed for imaging and data processing and Video and Data Processing Unit(VDPU) intelligent processing System on Chip (SoC). Compared with imported products, the company's MEMS microscope chip can reduce the price by 4 times, power consumption by 10 times, and chip size by 20 times; while its core device, VDPU intelligent processing SoC chip, can reduce the price by 10 times, power consumption by 30 times, and volume by 10 times.
Ainstec's international competitors include Broadcom(US) and Texas Instruments(US), and domestic ones include Hygon(688041.SH, Chinese:海光信息), Montage Technology(688008.SH, Chinese:澜起科技), and Cambricon(688256.SH, Chinese:寒武纪).