ECARX and SiEngine to Collaborate with FAW on Digital Cockpit Platform

Automotive Author: Kaiwen Li Editor: Ziying Wu Feb 09, 2023 04:16 PM (GMT+8)

Recently, ECARX and SiEngine announced that they have established a collaboration with FAW, to work on the development of high-performance digital cockpits based on the SE1000 System-on-the-Chip (SoC) from SiEngine.

ECARX

ECARX (Chinese: 亿咖通科技), a global mobility tech provider, and SiEngine (Chinese: 芯擎科技), an automotive semiconductor company and investee of ECARX, announced that they have established a collaboration with FAW, to work on the development of high-performance digital cockpits based on the SE1000 System-on-the-Chip (SoC) from SiEngine. The new digital cockpit is planned for mass production by the end of 2023 and will roll out to empower FAW vehicles.

Based on ECARX’s high-performance digital cockpit computing platform, code named E04, which is embedded with the SE1000 7nm SoC from SiEngine, FAW and ECARX will collaborate to develop the next digital cockpit intended for use in future FAW models. Planned for mass production by the end of 2023, the platform is the first to combine ECARX’s self-developed hardware computing module, global vehicle operating system, and software stack, with the SiEngine high-performance automotive-grade digital cockpit SE1000 SoC. It also supports Android Automotive and GAS-based Google services and experiences from its eco-system for the global market, collectively empowering automakers to deliver a market-leading smart cockpit solution.

The SE1000 SoC utilizes a 7nm AI processor combined with 8.8 billion transistors specifically designed for use in digital cockpits to meet the high performance, high reliability, and high security needs of automotive-grade hardware.

The collaboration between ECARX, FAW, and SiEngine is another important strategic milestone after ECARX listed on the Nasdaq on 21 December 2022. The platform marks the next step in ECARX’s mission to deliver a world-class vertically integrated full-stack computing system designed to reshape the future of smart mobility. Combined with the SE1000 SoC, the computing platform will provide consumers with a safer and more personalized intelligent travel experience. It is expected that two FAW Hongqi models equipped with the digital cockpit computing platform will be mass produced by the second half of 2023.