Capcon (华封科技) recently completed USD tens of millions in strategic financing.
Founded in 2014, Capcon is a high-end equipment manufacturer focusing on advanced packaging equipment, committed to providing customers with advanced semiconductor packaging product technology and solutions.
Capcon has a number of independent innovation technology patents. The main products have the characteristics of high precision, high speed, and high stability. Modular product customization can flexibly meet the needs of customer customization.
According to Yole, the global advanced packaging market size was about USD 35 billion in 2021, and the global market size of advanced packaging was expected to reach USD 42 billion by 2025. From 2019 to 2025, the global advanced packaging market grew at a CAGR of about 8%, which is higher than the traditional packaging market.
Capcon has a world-leading founding team and product technology in the field of advanced packaging equipment, and its mature equipment product line has been recognized by internationally renowned semiconductor packaging and testing manufacturers. Its clients include TSMC (台积电), ASE Group(日月光), SPIL (矽品), JCET (⻓电科技), Tongfu Microelectronics (通富微电), and DeeTee. Capcon currently has branches in Singapore, Taiwan, the Philippines, Beijing, and other places.
Packaging equipment has attracted a lot of companies to enter the market. Representative companies in China include ASE Group, SPIL, Powertech Technology (力成科技), and Huatian Technology (华天科技). Internationally, AMAT in the United States, Unisem in Malaysia, and ASMPT and DISCO in Japan are quite strong.
Capcon's this round of financing is led by Wise Road Capital (智路资本). This round of financing will mainly be used for production research and development and market expansion.