Chengdu Echint Technology Co., Ltd. (“Echint”) recently has announced the completion of over one billion CNY in Series B funding.
Echint is a company mainly engaged in integrated circuit board level advanced system assembly and test business, providing one-stop assembly and test services and solutions for global customers, including assembly design, chip sealing, and testing. Products are widely used in fields like mobile terminals, 5G, the Internet of Things, artificial intelligence, high-speed computing, automotive electronics etc.
According to Echint, it has been involved in high-density board level packaging technology for many years and has industry-leading high-precision process mass production capabilities. Its unique board level high-density system packing technology can correspond to advanced system integration packaging and chiplet solutions such as 2D FO, 2xD, 3D PoP, etc., achieving industry-leading levels in core process indicators such as chip offset control, warpage, and RDL.
According to Yole, the global advanced packaging market was worth USD 44.3 billion in 2022 and is expected to reach USD 78.6 billion by 2028, with a compound annual growth rate of 10%. This growth is driven by the increasing importance of packaging in semiconductor technology, the trend of advanced packaging in the post Moore era, and the increasing industrial value of assembly and testing.
In addition to Echint, many companies are competing in the advanced packaging market, such as CFMEE (芯碁微装), Xinyichang Tech (新益昌), GL Tech (光力科技), Quick Intelligent (快克智能), JT Automation (劲拓股份), Nextool (耐科装备)in China, Amkor Technology, Intel Corporation and ASE Group in the United States, and Samsung Electronics in Korea.
Liangchao Li, president of Echint, stated: “Echint will continue to drive development through innovation, continuously optimize product research and development capabilities, collaborate with upstream and downstream industries in innovation, and help China's semiconductor assembly and testing industry further strengthen international competitiveness. ”
This round of financing for Echint was exclusively invested by Matrix Partners (经纬创投) and Beite Fund (倍特基金), with follow-on investments from Tianhe Investment Fund (建投投资), Shangqi Capital (尚颀资本), Camel Group (骆驼股权), CDHTI Venture Capital (成都科创投), Xicheng Zhiyuan (熙诚致远), Boxeng Equity (博众信合), Baishide (佰仕德), Changan Huitong(长安汇通), Dongfang Jiangxia (东方江峡), Infore (盈峰投资), Best Capital (拔萃资本), Tongxi Capital (桐曦资本) and Rising Investments (鼎兴量子), Lighthouse Capital (光源资本) acted as the financial advisor.