EqualOcean has learned that kiwimoore (Chinese: 奇异摩尔), a high-performance interconnect products and solutions company, has recently secured CNY100 million in pre-A round financing.
Founded in early 2021, kiwimoore is a leading global high-performance interconnection product and solution company. The company's core products include high-performance interconnect cores such as 2.5D IO die, 3D base die, network acceleration cores, and a full range of Die2DieIP.
As the demand for computing power in large-scale models strengthens and the scale of computation expands, how to effectively connect computing power and form large-scale computing clusters has become a concern in the industry. kiwimoore focuses on the direction of high-performance computing, and based on the Kiwi-Link Unified Interconnect Architecture, we provide full-link interconnect and network acceleration chiplet products and solutions to help high-performance computing customers build high-performance computing more efficiently and at a lower cost. Kiwi-Link's chiplet products and solutions enable HPC customers to build large-scale distributed computing platforms more efficiently and at a lower cost.
Since its last financing round, Kiwimoore has made significant progress in its product offering. The company's core product, a high-performance general-purpose core die (3D interconnection core die), has successfully flowed. According to Zhu Jundong, kiwimoore's co-founder and vice president of product and solution, this product is the industry's first general-purpose base die that can integrate different core dies such as high-speed interfaces, low-speed interfaces and memory units into the same system. It is suitable for smart computing centers, automated driving, personal computing platforms and other high-performance computing fields. In addition, kiwimoore plans to launch a series of Die2Die IPs based on the UCIe standard for interconnecting different chiplets. It is reported that kiwimoore is one of the early members of the UCIe Consortium and has been heavily involved in improving the UCIe 1.0 standard and developing the UCIe 1.1 specification.
Kiwimoore has partnered with a number of major customers to innovate, develop, and promote the commercialization of high-performance big computing chips. Customers can stack their compute cores in 3D on Kiwi Base Die to realize arithmetic power stacking and 3D near-storage, thus significantly increasing chip performance and improving data transfer speed while shortening R&D time and reducing mass production costs.
In the future, kiwimoore will improve its interconnect layout for data center and high-performance computing, launch network acceleration-related chips, and promote the development of high-performance interconnect technology from intra-chip to inter-chip and inter-server levels.
This round of financing was led by CCT Fund (Chinese: 中国国有企业混合所有权改革基金), with major investors including ZGC Group (Chinese: 中关村发展启航), Lirongyuanchang Fund (Chinese: 历荣远昌), and others. Proceeds from the financing will be mainly used for the next generation of high-performance interconnection chiplet, network acceleration chiplet technology research and development, team expansion and market promotion.