EqualOcean has learned that Microview(Chinese: 微见智能), a high-precision die bonder equipment company, has recently completed nearly CNY 100 million of A+ round financing.
In recent years, due to the accelerated localization of high-end chips, the market demand for semiconductor packaging equipment continues to grow. According to CSIA statistics, China's semiconductor packaging and testing market size of about 10% annual growth, in 2022 is expected to reach a market size of about CNY 300 billion. SiP technology, 3D packaging and other technologies have gradually revealed the huge potential for application, packaging and testing equipment in the semiconductor equipment industry accounting for a gradual increase. However, the localization rate of semiconductor sealing and testing equipment is only about 10%, due to the monopoly of key sealing and testing equipment by foreign companies such as ASM and Besi.
Microview was founded in 2019 and is deeply engaged in the development and production of high-precision and complex process chip packaging equipment. The core members of the company have been working in Europe and the United States for a long time, with more than 20 years of experience in the high-precision chip packaging industry. For high-precision, high-speed and high-stability die bonder equipment, Microview's R&D team has mastered a complete set of independent core technologies, such as high-precision chip packaging process, high-precision mechanical operation and control platform, machine vision and algorithms, and high-precision process modules, etc.; at present, Microview's R&D personnel account for more than 60% of the total, and the company's R&D investment has accounted for more than 50% of the total expenditure in recent years.
In terms of product layout, Microview has launched general-purpose high-precision die bonder equipment series, special-purpose high-precision die bonder equipment series, and flip-changer series products. Among them, the general-purpose high-precision Die Bonder equipment series is Microview's main product, which is the key equipment for core chip packaging in the fields of optical communications, 5G RF, commercial lasers, high-power IGBT devices, storage, MiniLED displays, AR/VR, military, aerospace, etc., and supports many downstream application fields.
Over the past three years, Microview has completed process development and validation based on Microview's equipment with representative customers in a number of downstream industries and has established mass production lines using Microview's equipment. In the second quarter of this year, Microview's in-house developed and manufactured 1.5um grade high precision die bonder equipment with fully independent intellectual property rights was successfully exported to the European and American markets. "Before entering the U.S. market, we experienced more than a year-long validation cycle. This successful overseas entry means that Microview's product performance fully meets the international requirements for high-precision die bonder equipment," said Microview CEO Lei Weizhuang.
Looking ahead, Lei Weizhuang said: "Microview has always been both domestic and foreign markets, to achieve a leading position in the domestic market simultaneously for the overseas market to the global. With the expansion of customer territory, with excellent product strength, Microview in the customer's influence is in the stage of continuous improvement. We will seize the opportunity to continue to focus on the field of high-precision and complex processes, and develop more domestic high-end chip packaging equipment that meets international standards".
This round of financing was led by HT Capital (Chinese: 海通开元), followed by Share Capital (Chinese: 分享投资), and Profound Capital (Chinese: 深渡资本) continues to act as the exclusive financial advisor. Proceeds from this round will be mainly used for product development, technology upgrades and market expansion.