Nov 26, 2021 06:29 PM (GMT+8) · EqualOcean
Financial Associated Press, November 26 - the commissioning ceremony of Foxconn semiconductor high-end sealing and testing project was held in Qingdao West Coast new area today. With the smooth start of the first wafer level packaging test production line, the project officially entered the production and operation stage. The project is the first wafer level packaging and testing plant of Foxconn Technology Group. By introducing high-end systems such as fully automated handling, intelligent production and electronic analysis, it will build an industry-leading industrial 4.0 intelligent unmanned lighthouse factory. It is expected that about 30000 wafer chips will be sealed and tested every month after the delivery. Foxconn semiconductor high-end sealing and testing project was officially signed in April 2020, started construction in July and capped in December. It took only 18 months from commencement to mass production, creating a new speed of plant construction in the industry.

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