This text is a result of machine translation.
China’s OpenAI Challenger Zhipu AI Secures Over CNY 2.5 Billion to Step Further on Large-Scale Model
4Paradigm Initiates IPO Today and Targets HKSE on September 28
Electric Vehicles to Account for Two-thirds of Global Vehicle Sales by 2030
Power Device Company Maplesemi Completes Series A+ Financing Round
Acoustic Technology Company Audfly Completes Series B Financing Round
Wicue Raised CNY 200 Mn in Series C+ Financing Round
Beiyi Semiconductor Completes B+ Round Financing
May 9th, Beiyi Semiconductor(北一半导体) successfully completed its B+ round of financing. This round of financing was led by Wetogether Investment(吾同私募基金), with an initial investment of CNY 100 million, and an additional CNY 50 million is pending in the final installment, with an expected total financing amount of CNY 150 million.
May 10, 2024 03:38 PM
Intelligent Industrial Drone and UAV Systems Developer I-KINGTEC Closed A Series C+ Financing Round
Em-Data Technology Completed Strategic Financing Round
3D Printing Company Easy 3D Made Completes Series B Financing Round
Bioanalytical Company InterBio Completed Pre-A Round of Financing