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Shanghai to Launch Its First Direct Passenger Flight Route to a Central Asian Country in May
Anjoy Foods Q3 Net Profit Totaled CNY 386 million, with an Impressive YoY Increase of 63.75%
Survival Rules for Turbulent Times: A Compilation of the 20 Most Unmissable Core Insights from the 2026 Tsinghua PBCSF Forum
A dialogue between Zhu Min, former Deputy Governor of the People's Bank of China and former Vice Managing Director of the International Monetary Fund; Michael Spence, 2001 Nobel Prize winner in Economics and Philip H. Knight Professor Emeritus of Management at Stanford Graduate School of Business; and Masaaki Shirakawa, former Governor of the Bank of Japan, at the 2026 Tsinghua PBCSF Global Finance Forum.
May 18, 2026 02:22 PM
China’s OpenAI Challenger Zhipu AI Secures Over CNY 2.5 Billion to Step Further on Large-Scale Model
China's Outbound Non-financial Direct Investment Increased 18.8% YoY
Power Device Company Maplesemi Completes Series A+ Financing Round
Acoustic Technology Company Audfly Completes Series B Financing Round
Lens Technology Reports AI Server Component Orders as Dongguan Capacity Enters Ramp-Up
Lens Technology(蓝思科技)said in an October 26 investor-relations disclosure that it had completed an expansion of AI server-related capacity at its Songshan Lake campus in Dongguan. The company said liquid-cooling modules, high-end precision cabinets and high-speed optical interconnect components had passed validation by leading North American computing companies and secured volume orders, with production entering the ramp-up stage.
Updated 12 hours ago
DSBJ Sets Hong Kong Offer Price at HK$86.80 Ahead of Planned October 28 Listing
Suzhou Dongshan Precision Manufacturing Co., Ltd.(苏州东山精密制造股份有限公司), known as DSBJ, disclosed a final Hong Kong offer price of HK$86.80 per share ahead of its scheduled October 28 main-board debut. The offering would give the Chinese electronics manufacturer an additional offshore financing channel as it expands its printed circuit board and optical communications businesses.
Updated 12 hours ago
Wicue Raised CNY 200 Mn in Series C+ Financing Round
Intelligent Industrial Drone and UAV Systems Developer I-KINGTEC Closed A Series C+ Financing Round
Em-Data Technology Completed Strategic Financing Round
Silicon Integrity Passes HKEX Hearing as Capacity Expansion Keeps Margins Under Pressure
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.(江苏芯德半导体科技股份有限公司)has passed its Hong Kong main-board listing hearing, with post-hearing documents disclosed on October 21. Huatai International(华泰国际)is the sole sponsor. The proposed listing would provide another financing channel for the Chinese chip-packaging and testing company as it expands production while continuing to report losses.
Yesterday 02:55 PM
Unpacking China | Key Chinese Firms to Watch This Week (18/10/2026-24/10/2026)
Amid fast-paced changes that fill the business community with excitement, angst and trepidation, EqualOcean will publish a series of roundup articles to document the major events related to Chinese companies going global every week.
Oct 24, 2026 09:03 AM
3D Printing Company Easy 3D Made Completes Series B Financing Round
Chinese Digital Company Hengyuan Technology Raised CNY 100 Mn from Series B Financing Round
Capital Has No Passport - In an Age of Economic Sovereignty, how to position “China” in European Capital Markets?
Oct 21, 2026 04:46 PM
Which Way Is the Wind Blowing? How to Balance Geopolitics and Heavy Capex Investment
Oct 08, 2026 05:15 PM