Technology Author:Zhenduo Wang Feb 04, 2021 12:03 PM (GMT+8)

Founded in 2017, the semiconductor start-up is moving to take advantage of new opportunities in the packaging and testing industry.

Chip, semiconductor

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PrecisioNext has announced that it has raised CNY 100 million in a Series B led by Yuanhe Houwang Investment. Other investors include Yunqi Partners, Lightspeed China Partners and Beijing Fellow Partners. The newly-raised funding will be used on research and mass production preparation of IC packaging equipment and MiniLED packaging equipment. Part of the funding is also to be used for the company's expansion, especially in establishing a new East China facility.

 Founded in 2017, PrecisioNext has been focusing on the development and sales of semiconductor equipment and automation equipment. Nowadays, the company has developed two product lines, semiconductor packaging equipment and ultra-precision winding equipment, providing high-end equipment and solutions for IC packaging and MiniLED packaging. Its products have been adopted by several large players in the market, such as Huawei, Lucent, and Foxconn.

 Along with the rapid growth of packaging and testing technology and the large-scale transfer of facilities to China, China's IC packaging and testing industry is developing rapidly. We believe that PrecisioNext, with its funding injection and advanced technology, is a company worthy of watching.