Recently, sensing chip provider Fortsense closed C round of financing exceeding CNY 100 million, which will be used for LiDAR chips R&D.
Recently, Fortsense (Chinese: 阜时科技) announced the completion of its C round of financing exceeding CNY 100 million (USD 14 million), which was led by Chengdu Science and Technology Innovation Investment Group (Chinese: 成都科创投集团).
Other investors include BAIC Capital (Chinese: 北汽产投), Hui Capital (Chinese:惠友资本), Shenzhen Major Industry Investment Group (Chinese: 深圳市重大产业投资集团), Shenzhen Jiufite Private Equity Investment Management (Chinese:玖菲特), Zhuhai Hi-Tech Venture Capital Management (Chinese: 珠海高科创业投资管理), Suzhou Intelligent Vehicle Networking Industrial Investment (Chinese: 苏州智能车联网产投) and Shanghai SIIC Fund Management (Chinese: 上海国际创投).
The fund will be mainly used for the product R&D of LiDAR core chips.
Fortsense, founded in 2017 and based in Shenzhen, is a national high-tech enterprise focusing on the research and development of intelligent sensors, processor chips and algorithms and is committed to promoting the development of human-computer interaction.
The large-scale lidar landing still needs the price to be significantly reduced, while the SPAD technology of Fortsense is the critical point to lowering costs.
In the future, Fortsense will increase investment in technology research, maintaining competitiveness worldwide.