Changdian Technology: release xdfoi multidimensional packaging technology
Recently, Changdian technology announced the official launch of xdfoi ™ The full range of high-density fanout packaging solutions is designed to provide high cost performance, high integration, high-density interconnection and high reliability solutions for chip heterogeneous integration, which is highly concerned by global customers. It is expected to complete product verification and mass production in the second half of 2022.
This text is a result of machine translation.
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