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Mar 21, 2021 09:24 AM (GMT+8) · EqualOcean
PCB manufacturers in Japan and South Korea have shifted their production focus from traditional multilayer rigid board, high-end HDI, flexible PCB and rigid flex bonding board to IC substrate, according to media reports and industry sources. Due to the booming demand for ABF packaging substrates for high-performance computing chips and CMOS image sensor chips, the revenue of Japanese IC substrate suppliers Yifei Electric Co., Ltd. and shinko Electric Industry Co., Ltd. both increased significantly last year. Sources pointed out that the two Japanese companies will continue to invest heavily in expanding the production capacity of ABF substrates, and are expected to account for more than 30% of Japan's PCB output value this year. South Korea's IC substrate is expected to grow rapidly, which is expected to exceed 30% of PCB output value.

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